I am a student at Georgia Tech.I need Si wafers (4 inch) for making molds for microfluidic devices .SU 8 2000 will used as photo resist. I will be curing PDMS using these molds.Do you have any particular wafer for this purpose.any suggestions?
UniversityWafer, Inc. prides itself on providing our clients with the the highest qualtiy wafers at the lowest cost. In fact, you can buy as few as one silicon wafer here.
How we help researchers. Below is a typical question.
I am a student at Georgia Tech.I need Si wafers (4 inch) for making molds for microfluidic devices .SU 8 2000 will used as photo resist. I will be curing PDMS using these molds.Do you have any particular wafer for this purpose.any suggestions?
Please reference #201972 for specs/pricing.
Get Your 4 Inch Silicon Wafer Quote FAST!
Choosing a suitable silicon wafer is essential for semiconductor research. UniversityWafer, Inc.'s 100mm silicon wafers are a popular choice for researchers and semiconductor fabrication because they offer a good balance of performance and price. Our silicon wafers are perfect for prototyping and small-scale production, and we offer a variety of thicknesses and finishes to meet the need of researchers.
We have a large selection of standard and hard to find specs in stock. We work with the researcher to provide the best specs for their research. Fast delivery is a must and we carry in inventory the following. If you don't see what you need, just let us know!
A researcher contacted us for a quote:
Researcher:
I am looking for 4’' silicon wafers with a high quality 90 nm-thick dry thermal silicon oxide, i.e. with a high breakdown voltage. Could you send me a quote?
For this 90nm wafer, I use it for transfer 2D materials and get the layer number information from the optical contrast under optical microscope. In general, the 2D research group uses 90nm SiO2/Si because it gives you the best optical contrast as function of layer numbers.
Q&A:
Q1) I am looking for 4’' silicon wafers with a high quality 90 nm-thick dry thermal silicon oxide, i.e. with a high breakdown voltage.
A1) Some information on breakdown voltage is available in the subject literature. For example, you can find on the Internet "J.M Soden, The dielectric strength of SiO2 in a CMOS transistor structure".
Q2) Could you send me a quote?
A2) Please find the quote GY86 above.
Q3) If you know what types of 90nm dry thermal oxide wafer other 2D research team uses, that would be helpful.
A3) I am sorry I do not have this information.
UniversityWafer, Inc. Quoted:
Item Qty. Description
GY86. 25 Silicon wafers, per SEMI Prime, OxP/EOx 4"Ø×460±20µm,
P/B[100]±0.5°, Ro=(8-12)Ohmcm,
TTV<5µm, Bow<10µm, Warp<20µm,
One-side-polished, back-side Alkaline etched (both with oxide),
Dry thermal oxide: 90±6nm,
2 Flats,
Sealed in Empak or equivalent cassette.
Price: $Contact Us
The thickness of a 4 inch silicon wafer can vary depending on its specific application and manufacturing process. However, as a general guideline, the standard thickness for a 4 inch silicon wafer is around 525 micrometers (0.525 millimeters or 0.0207 inches).
It is important to note that the thickness of silicon wafers can be customized to meet specific requirements, and therefore can vary from wafer to wafer depending on the needs of the customer or the specific manufacturing process.
Even with silicon sizes greater than 12 inch available, 4 inch wafers are still ubiquitous for reseaching electronic devices and semiconductors. The popularity of 4 inch remains robust because the tooling requied to fabricate semiconductors is very expensive. Legacy systems still work fine. So clients choose the much easier to use and store 4 inch silicon as their first choice for research and low volume production.
Below are just some of the ongoing sales.
The non-ferrous metal corporation (SUMCO) announced on Friday that it is expanding its particle production facility in the United States. The company will use a 4-inch silicon wafer production facility at the University of Texas Southwestern Medical Center (U - TSMC) in Austin, Texas, which is capable of building up to 20,000 silicon wafers per month. American silicon, or silicon, cut from a premium grade Silicon wafer is tested on a silicon wafer. U-TSMC said the factories would create more than 1,600 jobs and produce thin silicon discs used every month to make products such as integrated circuits and high-performance electronics. [Sources: 4, 6]
According to CEO Hashimoto, the cost of producing 300mm semiconductors is currently below 5%. SEMI, he outlined a scenario in which deliveries of silicon wafers depend on price negotiations that will last until 2021 and have an average annual growth rate of 3% to 4% in 2020. In 2016, 300-mm wafers were worth $1.5 billion (Nbsp) a year, up from $2.1 billion in 2015. However, this will experience a slight decline due to the fall in silicon prices and the falling demand for the product, the CEO said. [Sources: 4]
Silicon Wafers (UniversityWafer, Inc.) offers a comprehensive list of silicon wafer suppliers, also known as the "gold standard" in the market for the production of high-end semiconductors. There are a number of different types of silicon wafers that are available in this market and there is a wide variety of sizes, shapes, sizes and prices for each of them. This is due to the fact that there are many different types of semiconductor products at different prices, so there has to be a very wide range of solutions for silicon wafer suppliers to serve a very wide variety of customers. [Sources: 4]
Bare Silicon wafer pricing is based on the price of the wafer, which is about $21 on a volume basis. This is the cheapest of all products, or at least the lowest price available on the market at the time of purchase. [Sources: 2, 4]
Nbsp silicon wafers are available in a variety of diameters up to 25 '' ', but we are looking for a 4 inch silicon wafer with a diameter of 4.5'. " Compared to other Silicon wafer suppliers, prices for Powerway wafers are more competitive and of higher quality, and the 39 '"' S. S., London. The price of Silicon wafers is the best we have found online compared to some other suppliers. [Sources: 4]
Silicon wafers are available in various diameters up to 25 '' 'and can be offered in sizes 4 inch, 6 inch and 12 inch. The thickness of the wafer ranges from 775 "'for a 12-inch wafer to 1.5"' '' for a 6-inch wafer and from 1 "'to 2"' for the 4 "and 6" diameter wafers. [Sources: 2, 9]
Semiconductor factories, colloquially known as Fabs, are defined because they are able to process the wafers they produce. The manufacturing process of a silicon wafer involves many complex steps. Silicon wafers are available in various diameters up to 25 '' 'and in sizes 4 inch, 6 inch and 12 inch. A 300 mm wafer has a diameter of about 11 '' and a 1.5 '' wafer measures about 3'' in diameter. [Sources: 4, 5]
Great care must be taken to minimise the costs of silicon wafers and the quality of their manufacturing process. Historically, it has been much easier for foundries and factories to buy cheap silicon wafers online. Silicon wafer suppliers can be time consuming and difficult to find The best polished Silicon Wafer deals are obtained directly from their suppliers. Search for the cheapest Silicon wafer you can find on their website or on the online market. Finding the right Silicon wafer supplier for inexpensive 4-inch silicon wafers or other small silicon products can be either time consuming or difficult. Find the inexpensive silicon discs that we can find on our website or on online markets. [Sources: 4]
Polishing techniques have a major impact on the wafer surface result, which is why we apply sophisticated, polished and rigorous inspection processes to produce world-class silicon wafers. The defects in wafers range from imperfections buried in silicon mass to manufacturing process defects such as cracks, scratches and other defects. Over the last five decades, we have developed a number of techniques to dice the silicon on a wafer to separate the cubes from the wafer. [Sources: 0, 1, 8]
To demonstrate the cube process, we produced a 4-inch silicon wafer (Fig. 1) with a diameter of 1.5 mm and a thickness of 2 mm (Fig. [Sources: 10]
We can use small silicon substrates that are produced by cubing the wafer into smaller pieces using the break-down process (Fig. 2). Wafers grown with standard semiconductor processes are not usually available in sizes larger than 100 mm and have a diameter of less than 1.5 mm or a thickness of 2 mm. GSM - TFTs) Can be made with materials other than silicon, but these have either smaller diameters (1 mm) or thicker thicknesses (3 mm) and they do not have the same thermal conductivity as standard silicon wafers (4 mm). [Sources: 3, 5, 7, 9]
Sources:
[1]: https://cleanroom.byu.edu/ew_wafer_specs
[4]: http://www.romfords.com/usa-studies/300mm-silicon-wafer-price.html
[5]: https://en.wikipedia.org/wiki/Wafer_(electronics)
[6]: http://docreels.com/tr6-soft/tsmc-fab-arizona-location.html
[7]: https://scorpionwindowfilm.nl/ice-table/wafer-gsm.html
[8]: https://silverbulletcutters.com/silicon-wafer-dicing.aspx
[9]: https://www.wikidoc.org/index.php/Wafer_(electronics)
[10]: https://link.springer.com/article/10.1007/s00542-014-2198-4
Could you recommend a Si wafer for me that is
I would like it to be a 4" wafer. I would start out with a 10 wafer order, to make sure the samples are compatible with the process. As for any doping aspect, that is where I am not sure if, during the heat treatment some alteration of the dopant would lead to a change of wafers resistance.
Is this wafer compatible with metal patterning / deposition? I assume so, but I wanted to make sure before placing an order. Could you send me the full specs of the wafer?
UniversityWafer, Inc. Quoted:
Yes, it is compatible with metal patterning / deposition.
1) Every Silicon wafer is stable at 1,000ºC. Various Epi deposition processes run at 1,000ºV. Some of the dopants (especially Arsenic and Antimony) do outgas from wafers in amounts enough to limit the resistivity of deposited Epi layers.
2) Resistivity of CZ crystallized Silicon, doped with Boron to a resistivity of approximately > 0.1 Ohmcm does change materially depending on how quickly it is cooled. This is why such ingots or wafers are heat treated before use. Silicon wafer manufacturers call it annealing although in fact it is a quenching or a tempering process. It involves precipitating Boron-Oxide compounds.
From above arguments, it is clear that you want to use undoped or Phosphorous doped Silicon wafers.
Visit our store for more 4 inch silicon stock wafers for immediate shipment:
Diameter 100mm +/-0.3mm
Type P/Boron
Orientation <100>
Resistivity 1 – 20ohm-cm
Thickness 525um+/-25um
Single side polished
We are looking for a vendor who can coat small batches of silicon wafers (~10 each, currently using 4" but flexible) with a stack of several metals. I saw all the metals we're interested in in an email you sent around a while ago and was wondering what your wafer preparation capabilities are. Could you run wet processes like SC-1, SC-2, HF? I assume you could run sputter etch processes before deposition? How many metal layers can process in one run without exposing the previous layer to air?
UniversityWafer, Inc. Replied:
Our facilities for coating wafers with metals, include:
Electron Beam Evaporation, (MOQ 8 of 4"Ø wafers)
Sputtering, (MOQ 1 or 22 of 4"Ø wafers)
LPCVD, (MOQ 25 of 4"Ø wafers)
PECVD, (MOQ 25 of 4"Ø wafers)
Electroplating, (MOQ 1 of 4"Ø wafers)
We do SC-1 and SC-2 cleans, and we can clean in dilute HF acid.
Depending on what coating mechanism is used and other factors, we can deposit up to 7 different metals in one reactor run.
Scientist have used 4-inch <100> silicon wafer with one side polished is thoroughly cleaned and used as the substrate in the photolithography process. And a positive photoresist SPR 220 ( is spin-coated on the polished side of the wafer to form a 4.5 µm covering layer, followed by asoft-bake at 60 °C for 2 min and 110 °C for 1 min. The photoresist is then exposed with an i-line (365 nm) maskaligner (EVG 620) with an exposure dose of 180 J/cm.
Let us know what we can quote for you!?
Scientist: We're looking for Prime CZ p-doped, single side polished, 0.001-0.0005 ohm, orientation (100), thickness 525um +/- 25um, 4 inch silicon wafers. We're planning to pilot study mesoporous silicon nanoparticle production using HF galvanostatic production. We are in the pilot study phase. Could you please help us with pricing of the smallest package of specified wafers?
Mesoporous Silica Nanoparticulates have received increasing attention from the scientific community for their multifunctional applications as a platform for nanomedicine. Since their discovery in the early 1990s, this inorganic nanomaterial has attracted researchers' attention due to their promising applications in biotechnology and diagnostics. Mesoporous particles have high surface areas, which enable them to load diverse cargos or combinations of cargos.
HF galvanostatic charging is a method of charge-discharge that uses an electric current to create an electrical charge in an object. HF galvanostatic charging has two main types: capacitive and resistive. Both types are used in the electrochemical industry. These galvanostatic systems are effective for charging and discharging various types of devices. However, there are a few differences between the two types.
HF galvanostatic charging tends to increase the potential of the object being charged. However, a longer charging time can result in dissipation of energy due to the resistor. Therefore, a higher voltage will be required in the initial region. The resulting electrodes will have a lower capacitance than the ideal case. It is important to understand the differences between the two types of galvanostatic charging.
The main differences between HF galvanostatic and potentiostatic methods are the current and voltage ranges. The former has an auxiliary load that is used in electrochemistry experiments, while the latter is used for a single electrode application. HF galvanostats, in contrast, use an alternating current. This allows researchers to study the interaction between two metals. They can also use them to determine the corrosion rate in different materials.
A 4 inch silicon wafer is a circular disk made of pure silicon that is typically used in the semiconductor industry for the production of microelectronic devices such as transistors, diodes, and integrated circuits. The wafer is typically around 4 inches (100 mm) in diameter and a few hundred micrometers thick. It is typically made from single crystal silicon, which is a highly pure form of the material with a specific crystalline structure.
The production of a silicon wafer involves several steps, including growing a large crystal of silicon, slicing the crystal into thin wafers, and then polishing the wafers to a high degree of flatness and smoothness. The wafers are then used as the substrate for the production of microelectronic devices, which involves various processes such as photolithography, etching, and deposition.
Silicon wafers are used in a wide range of electronic devices, including computers, smartphones, and other consumer electronics. They are also used in the production of solar cells, which convert sunlight into electricity, and in a variety of other industrial and scientific applications.
The cost of a 4 inch silicon wafer can vary significantly depending on a number of factors, including the quality and purity of the silicon, the thickness of the wafer, and the number of wafers being purchased. In general, the price of a 4 inch silicon wafer can range from a few dollars to several hundred dollars, with higher-quality wafers typically costing more.
There are also several different grades of silicon wafers available, each with its own set of characteristics and corresponding price range. For example, high-purity, single crystal wafers may be more expensive than lower-quality, multi-crystal wafers. Additionally, the price of a 4 inch silicon wafer may vary depending on the quantity being purchased, with bulk discounts often available for large orders.
It is worth noting that the cost of a 4 inch silicon wafer is only a small part of the overall cost of producing microelectronic devices. There are many other steps involved in the production process, including photolithography, etching, and deposition, which can significantly increase the overall cost of the final product.